1. general description the 74hc27-q100; 74hct27-q100 is a triple 3-input nor gate. inputs include clamp diodes. this enables the use of current limiting resistors to interface inputs to voltages in excess of v cc . this product has been qualified to the automotive electronics council (aec) standard q100 (grade 1) and is suitable for use in automotive applications. 2. features and benefits ? automotive product qualif ication in accordance with aec-q100 (grade 1) ? specified from ? 40 ? c to +85 ? c and from ? 40 ? c to +125 ? c ? complies with jedec standard jesd7a ? input levels: ? for 74hc27-q100: cmos level ? for 74hct27-q100: ttl level ? esd protection: ? mil-std-883, method 3015 exceeds 2000 v ? hbm jesd22-a114f exceeds 2000 v ? mm jesd22-a115-a exceeds 200 v (c = 200 pf, r = 0 ? ) 3. ordering information 74hc27-q100; 74hct27-q100 triple 3-input nor gate rev. 1 ? 3 june 2013 product data sheet table 1. ordering information type number package temperature range name description version 74hc27d-q100 ? 40 ? c to +125 ? c so14 plastic small outline package; 14 leads; body width 3.9 mm sot108-1 74hct27d-q100 74hc27pw-q100 ? 40 ? c to +125 ? c tssop14 plastic thin shrink small outline package; 14 leads; body width 4.4 mm sot402-1 74hct27pw-q100 74hc27bq-q100 ? 40 ? c to +125 ? c dhvqfn14 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 ? 3 ? 0.85 mm sot762-1 74HCT27BQ-Q100
74hc_hct27_q100 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 3 june 2013 2 of 15 nxp semiconductors 74hc27-q100; 74hct27-q100 triple 3-input nor gate 4. functional diagram 5. pinning information 5.1 pinning fig 1. logic symbol fig 2. iec logic symbol fig 3. logic diagram (one gate) mna936 1a 1b 1y 2 1 12 1c 13 2a 2b 2y 4 3 6 2c 5 3a 3b 3y 10 9 8 3c 11 mna935 12 1 1 1 2 1 6 4 3 8 10 9 13 5 11 mna937 a b c y (1) this is not a supply pin. the substrate is attached to this pad using conductive die atta ch material. there is no electrical or mechanical requi rement to solder this pad. however, if it is soldered, the solder land should remain floating or be connected to gnd. fig 4. pin configuration so14, tssop14 fig 5. pin configuration dhvqfn14 + & |